Data Centers

Photonic integration and co-packaging: Design tools for footprint optimization in data center networks

As traffic within and between data centers continues to grow, operators need to constrain the resulting increase in power consumption to minimize operational costs. This is driving the need to manage footprint and power at the system design level. Photonic integration and co-packaging are related approaches to addressing area and power challenges for networking applications. These component-level design options will enable future footprint-optimized solutions for data centers.

Sourced through Scoop.it from: www.ciena.com

Categories: Data Centers, Fiber

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