IPDiA (a Murata company) has developed a new series of Ultra-Broadband Wire Bonded Silicon Capacitor (UBEC) with 0201 (0.6×0.3mm) form factor.
Compared with surface mounted solution (figure 1), these new capacitors enable a direct interconnection between the ICs without using an electrical conductor on a laminate or ceramic substrate which results in no degradation of the signal. Moreover, this direct interconnection leads to space saving and avoids a surface mounting step.
