Fischer Connectors has developed new high-speed data and power connectivity solutions combining Single Pair Ethernet and USB 3.2 Gen 2 high-speed protocols with the rugged, high-density and miniature features of its flagship product lines. They enable space-saving and cost-efficient integration in industrial automation and robotics, chemical plants, food processing, automotive production lines, outdoor sensing and unmanned systems.
To support emerging technologies and ever-increasing amounts of data, large hyperscale and cloud data centers like AWS, Google Cloud, Meta, Microsoft Azure, and Equinix have quickly migrated to 400 Gigabit speeds for switch-to-switch links and data center interconnects, as well as for switch-to-server breakout configurations. Now these big-name data centers are gearing up to deploy 800 Gig and looking ahead to 1.6 and 3.2 Terabit speeds, while 400 Gig starts making its way into large and even mid-sized hosted and enterprise data centers.
Deploying and maintaining an edge data center requires specific focus on both communications infrastructure as well as the equipment that houses and protects that infrastructure. Add to the mix that the term “edge” can be defined in a number of ways, and meeting customer expectations requires significant planning and project management during an edge deployment. This On Topic Report, focused on Edge Networking, acknowledges the reality that edge can mean different things to different users. In that vein, it provides practical information about the edge’s place in the larger network landscape, and delivers useful information about deploying the right solution for users’ needs.
Microchip has introduced a range of industrial-grade Single Pair Ethernet (SPE) devices for IIoT and industrial Operational Technology (OT) networks for low-speed Ethernet edge devices and a simplified cabling infrastructure for latency-sensitive applications.
Network infrastructure can be sustainable throughout the value chain, from manufacture to installation, and future planning…
In today’s hyperconnected world, companies need a way to scale and analyze data faster, cheaper and better. The only way to do that is to move out of the cloud and on to the edge of the network, where most of the future data will be generated, analyzed and processed.
While smart building technologies are vital to improving building efficiency, the actual technology products deployed throughout a smart building are mostly made up of fossil fuel derivatives and mined from non-renewable resources—from the IoT devices to the networks that connect them. That inherently makes it unfeasible for most of these products to be considered low-carbon construction materials. Even so, there are ways to reduce their impact. CommScope’s Ronna Davis covers five options.
Danfoss Power Solutions’ new family of universal quick disconnect couplings for data center liquid cooling applications helps data center operators meet the thermal management challenges of more powerful chips, denser racks, and heavier workloads through reliable, leak-free, efficient operation.The UQD couplings are ideal for in-rack liquid cooling applications that use smaller hose lines offering a 25% higher flow rate than OCP community standards and a low pressure drop which improves system efficiency and reduces in-rack power consumption, providing long-term cost savings.
US Conec filed a response to a Senko Advanced Components suit that alleges US Conec violated SENKO patents on very small form factor (VSFF) fiber-optic connectors denying the allegations and contains allegations that Senko violated US Conec patents. SENKO, in a written statement to Lightwave reaffirmed that it expects to triumph in court. Both companies make VSFF connectors and associated adapters – the CS, SN, and SN-MT connectors in SENKO’s case, and the MMC and MDC connectors in US Conec’s.
Applications are moving from older fieldbus-style networks to Ethernet, which is now widely regarded as a key enabling technology for the Fourth Industrial Revolution, or “Industry 4.0.”
